TechGirls Scholarship Program



In case you have a daughter who may be interested. It’s a competitive but rewarding experience.

U.S. Department of State TechGirls Program 2023 for next generation of young women in STEM (Fully Funded to the United States)

Application Deadline: 

January 15, 2023


TechGirls connects and supports the next generation of women leaders in science, technology, engineering, and mathematics by providing them access and opportunities to advance their skills and pursue their dreams.

The core of the program is a 27-day experience in the United States in partnership with Virginia Tech University (tentatively scheduled for July 2023). TechGirls participate in an interactive technology and computer camp, then travel to one of the following cities (Austin, Chicago, Cincinnati, Denver, Detroit, Portland or Seattle) for job shadowing at a tech company, and homestay and community service experiences. The TechGirls programming yields a multiplier effect as participants return home to educate their peers and create community based projects.



Are between the ages of 15 and 17 at the start of the exchange July 7th, 2023;

Have demonstrated advanced skills and a serious interest in technology, engineering, and/or math in their academic studies;

Intend to pursue higher education and/or careers in technology;

Have strong English language skills;

Exhibit maturity, flexibility, and open-mindedness;

Will attend at least one additional semester of secondary school upon their return to their home country; and

Are committed to completing a community-based project upon their return home.


Covered Costs

The TechGirls program covers the following costs:


Visa Fee

Roundtrip international airfare from participant home country to the United States

Housing during program

Double occupancy dormitory accommodations

Meals during program

Breakfast, lunch, and dinner

Local transportation to group program events

Cultural events organized by Legacy International

Emergency health insurance

Similar Posts

Leave a Reply

Your email address will not be published. Required fields are marked *